Physical design turns logical circuit intent into a geometric silicon layout that can satisfy timing, routing, power, and manufacturing requirements. The process begins with implementation planning, where the design is organized into physical regions and prepared for downstream optimization. A top-level netlist provides the logical connectivity, while physical constraints define die size, block area, I/O organization, power resources, and early implementation limits. Floorplanning establishes the first major physical structure of the chip. It defines die dimensions, allocates area for soft blocks, places or reserves space for macros, organizes I/O locations, and prepares power structures. Block placement, module organization, utilization control, and routing-resource planning are handled at this stage to reduce downstream risk. Flightlines and connectivity views help reveal communication intensity between blocks, allowing highly connected regions to be placed closer together and reducing unnecessary wire length. Placement converts the floorplan into legal cell locations. Sites and rows define where cells may be placed, while library information determines the legal row type for e...