This course presents a complete and practical view of digital IC physical implementation, focusing on how logical designs are transformed into manufacturable silicon layouts. It covers the physical decisions that determine performance, power efficiency, reliability, and yield, emphasizing how abstract intent becomes real geometry, wires, and electrical behavior. The course starts with physical organization at the chip level. Floorplanning is used to define die area, block placement, and early physical constraints that shape all downstream results. Power planning follows, addressing how supply and ground are delivered across the chip under real current demand, voltage drop, and long-term reliability limits. Placement and physical synthesis form the next stage, where standard cells are assigned physical locations and optimized with awareness of timing, congestion, and power. These steps establish routing feasibility and timing behavior while revealing the impact of real interconnect distances. Physical synthesis is introduced to align logical optimization with physical reality as wire delays become dominant. Clock distribution is treated as a core physical system. The course expla...