Power Planning for Reliable Chip Delivery
Instructor: EDA Academy
Resource—All LevelEnglish
Power planning defines reliable power and ground delivery for digital ICs through rings, stripes, rails, meshes, vias, and routing structures, while managing IR drop, electromigration, power consumption, routing resources, and multi-voltage power domains.
5.0
1students
This offering includes
- 1 module
- 5 lectures
- Access on mobile and computer
- 1.12 hours on-demand video
Description
Power planning is a core physical design activity that defines how supply and ground networks are built across a digital integrated circuit. It determines how current enters the chip, how it reaches macros and standard cells, and how stable voltage is maintained under real switching conditions. A well-structured power delivery network supports timing closure, functional correctness, manufacturability, and reliability by giving every part of the design a strong electrical path to VDD and VSS.
The main technical focus is power integrity. Current flowing through resistive metal creates IR drop, reducing the actual voltage available to logic cells. Excessive voltage loss can damage timing margin and cause failures during high activity. High current density also creates electromigration risk, gradually weakening metal wires and vias over time. These issues require systematic control through wire sizing, metal layer selection, via capacity, mesh density, and early rail analysis.
The physical network is built from several connected structures. Power pads bring supply into the chip. Core rings and block rings distribute current around major regions. Power stripes and meshes spread current across the floorplan with stronger coverage and redundancy. Followpin rails connect standard-cell rows to the larger network, while special power routing connects global nets to standard cells, blocks, and I/O pads. Each structure has a specific role in creating a complete power path.
Modern designs add more complexity through dynamic power, leakage power, and multiple supply voltages. Switching activity changes current demand across time, while leakage remains present even during idle states. Multi-voltage designs reduce power by matching voltage levels to performance needs, but they require careful domain partitioning and separate power-grid planning. Strong power planning connects electrical requirements with physical implementation, reducing late-stage IR drop violations, electromigration problems, and power-routing risks.
Catalogue:
Power Planning Fundamentals
Global Power Network Planning
IR Drop and Electromigration
Power Analysis Inputs and Outputs
Goals of Power Planning
Why Power Planning Matters
Basic Elements of Power Planning
Early Power Planning Activities
Power Planning Methodologies
Trunks and Rings Power Planning
Uniform Chip Power Grid
Power Stripes in Power Planning
Power Mesh Planning
Followpins and Connect Ring Usage
Power Routing Connections
Power Routing with Special Route
Power Routing Flow
Chip Power Consumption Basics
Multiple Supply Voltages
Power Planning for Multi-Voltage Chips
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