Modern digital integrated circuits no longer succeed on transistor design alone. As performance increases and process nodes advance, the package has become a critical system that determines whether a chip can deliver power reliably, move signals cleanly, dissipate heat effectively, and scale economically. This course presents a structured and practical view of digital IC packaging as an essential engineering discipline that connects silicon design, manufacturing reality, and system-level performance. The course begins by placing packaging in its real-world context. Economic scale, manufacturing cost, verification effort, and schedule pressure shape every technical decision. Understanding why chips are developed the way they are, why deadlines are rigid, and why failure is costly provides a foundation for all packaging choices that follow. From there, the course builds a clear picture of how packaging enables transistor scaling, higher I/O counts, and increasing system integration. Fundamental packaging concepts are introduced next, including package efficiency, pin evolution, die attachment methods, and the tradeoffs between wire bonding and flip chip approaches. These ideas expl...